颗粒尺寸对金刚石/Al封装基板热物性的影响

周洪宇, 冉珉瑞, 李亚强, 张卫冬, 刘俊友, 郑文跃

Effect of Diamond Particle Size on the Thermal Properties of Diamond/Al Composites for Packaging Substrate

ZHOU Hongyu, RAN Minrui, LI Yaqiang, ZHANG Weidong, LIU Junyou, ZHENG Wenyue

图4 不同尺寸金刚石颗粒所制备的金刚石/Al复合材料断口的SEM像

Fig.4 SEM images of fractures of diamond/Al composites with diamond particle sizes of 90 μm (a), 106 μm (b), 124 μm (c), and 210 μm (d) (Arrows show the interfacial debonding areas that are unfilled by Al)