图12. 高通量DFT计算辅助的θ'-Al₂Cu界面多元偏聚筛选与Sc-Fe-Si“三明治”型偏聚结构的构建，及对应的Al-Cu-Sc-Fe-Si合金在300℃下具有极为稳定的θ'-Al₂Cu与优异的蠕变性能^[172]

Fig.12. Targeted atomic locations (a~d) and segregation-sandwiched Sc-Fe-Si segregation (e~m) at θ'-Al₂Cu/matrix interface, obtained from high-throughput density functional theory (DFT) calculations and experiments, respectively; and curves showing the ultra-stabilized θ'-Al₂Cu precipitates (n) and unprecedent creep resistance (o) at 300^oC in the studied Al-Cu-Sc-Fe-Si alloy (Δρ_SC,Fe and Δρ_Fe are the changes in bonding charge density; {\bar{L}}_{{\theta }^{\text{'}}} is average half length of θ'-Al₂Cu precipitates; \dot{\epsilon } is the steady-state creep rates of the studied alloys, σ—tensile creep stress)^[172]