| Vat polymerization | The build platform is lowered into a vat of liquid photopolymer resin. A UV light cures the |
| resin in layers on top of the platform. |
| Alternative name: SLA—stereolithography apparatus, DLP—digital light processing |
| Resolution: 10 μm |
| Material jetting | Droplets of material are deposited onto the surface using a thermal or piezoelectric method. |
| Each layer is cooled or cured by UV light. |
| Alternative name: inkjet printing, MJM—multi-jet modeling |
| Resolution: 25-100 μm |
| Material extrusion | A material spool is fed and melted through a heated nozzle and deposited onto the surface, |
| layer by layer. |
| Alternative name: FDM—fused deposition modeling |
| Resolution: 50-200 μm |
| Powder bed fusion | The material in powder form is spread over the surface and fused to other layers using a laser |
| or electron beam. |
| Alternative name: SMS—selective metal sintering, SHS—selective heat sintering, DMLS— |
| direct metal laser sintering |
| Resolution: 80-250 μm |
| Binder jetting | Building material in powder form is rolled/spread into a flat sheet. A liquid binding agent is |
| selectively applied between layers as an adhesive. |
| Alternative name: PB—powder bed printing |
| Resolution: 80-250 μm |
| Sheet lamination | Material in sheet form is placed on a cutting bed and bonded over the surface using an |
| adhesive. Each layer is cut to shape by laser, knife, or drill after bonding. |
| Alternative name: UC—ultrasonic consolidation, LOM—laminated object manufacturing |
| Resolution: depends of thickness of laminates |
| Direct energy deposition | Material, typically in the form of a powder or wire, is deposited onto the surface and melted |
| using a laser or electron beam upon deposition. |
| Alternative name: LMD—laser metal deposition, LENS—laser engineered net shaping |
| Resolution: 250 μm |