CoCrFeMnNi高熵合金作为中间层的Cu/304不锈钢扩散连接研究
|
Diffusion Bonding of Copper and 304 Stainless Steel with an Interlayer of CoCrFeMnNi High-Entropy Alloy
|
图3. 不同温度下界面附近显微硬度和850 ℃扩散偶的硬度分布图 |
Fig.3. The microhardness near the interface at different temperatures (a) and the distribution of the hardness of the diffusion couple interface at 850 ℃ (b) |
![]() |