原位研究Cu/Sn-37Pb/Cu微焊点液-固电迁移行为
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In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect
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图5. Cu/Sn-37Pb/Cu焊点液-固电迁移过程Pb原子扩散通量及微观组织演变示意图 |
Fig.5. Schematics of the Pb atomic fluxes and the microstructural evolution in Cu/Sn-37Pb/Cu interconnects during L-S EM ( |
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