原位研究Cu/Sn-37Pb/Cu微焊点液-固电迁移行为
张志杰1, 黄明亮2()
In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect
ZHANG Zhijie1, HUANG Mingliang2()

图5. Cu/Sn-37Pb/Cu焊点液-固电迁移过程Pb原子扩散通量及微观组织演变示意图

Fig.5. Schematics of the Pb atomic fluxes and the microstructural evolution in Cu/Sn-37Pb/Cu interconnects during L-S EM (JchemPb and JemPb are the Pb atomic fluxes induced by chemical potential gradient and EM, respectively)(a) heating stage (b) dwelling stage (c) cooling stage