原位研究Cu/Sn-37Pb/Cu微焊点液-固电迁移行为
张志杰1, 黄明亮2(
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In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect
ZHANG Zhijie1, HUANG Mingliang2()
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图4. Cu/Sn-37Pb/Cu焊点液-固电迁移过程中富Pb相的生长动力学曲线
Fig.4. The growth kinetics of the Pb-rich layer in the Cu/Sn-37Pb/Cu interconnects as a function of L-S EM time
