原位研究Cu/Sn-37Pb/Cu微焊点液-固电迁移行为
张志杰1, 黄明亮2(
)
)
In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect
ZHANG Zhijie1, HUANG Mingliang2()
)
图3. 185 ℃、1.0×104 A/cm2液-固电迁移后的Cu/Sn-37Pb/Cu焊点的SEM像
Fig.3. SEM images of the Cu/Sn-37Pb/Cu interconnects after L-S EM under 1.0×104 A/cm2 at 185 ℃(a) whole interconnect(b) anode interface(c) cathode interface
