原位研究Cu/Sn-37Pb/Cu微焊点液-固电迁移行为
张志杰1, 黄明亮2(
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In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect
ZHANG Zhijie1, HUANG Mingliang2()
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图2. Cu/Sn-37Pb/Cu焊点在185 ℃、1.0×104 A/cm2条件下液-固电迁移过程中的同步辐射照片
Fig.2. Synchrotron radiation images of the Cu/Sn-37Pb/Cu interconnect during liquid-solid electromigration (L-S EM) under 1.0×104 A/cm2 at 185 ℃ in the heating stage (a), dwelling stage (b) and cooling stage (c)
