原位研究Cu/Sn-37Pb/Cu微焊点液-固电迁移行为
张志杰1, 黄明亮2(
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In Situ Study on Liquid-Solid Electromigration Behavior in Cu/Sn-37Pb/Cu Micro-Interconnect
ZHANG Zhijie1, HUANG Mingliang2()
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图1. Cu/Sn-37Pb/Cu线性焊点示意图和电迁移试样示意图
Fig.1. Schematics of the line-type Cu/Sn-37Pb/Cu solder interconnect (a) and line type interconnect used for electromigration (b)
