含水条件下单晶Cu的应力松弛及弹性恢复
史俊勤1,孙琨2,方亮2,许少锋3(
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Stress Relaxation and Elastic Recovery of Monocrystalline Cu Under Water Environment
Junqin SHI1,Kun SUN2,Liang FANG2,Shaofeng XU3()
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图6. 无水膜及水膜厚度为1.0、2.0、3.0 nm时纳米压入过程结束(左)、应力松弛后(中)及卸载结束后(右)压痕区域的缺陷构型
Fig.6. Default configurations within monocrystalline copper after loading (left), after stress relaxation (middle), and after unloading (right) of without (a), and with H=1.0 nm (b), 2.0 nm (c) and 3.0 nm (d) water films (blue—undeformed atom, red—surface and partial dislocation atom, green—stacking fault atom)Color online
