图5. 无水膜及水膜厚度为1.0、2.0、3.0 nm时压头卸载前(橙色)后(蓝色)单晶Cu切片构型图
Fig.5. The slice configurations of monocrystalline copper before (orange) and after (blue) unloading of without (a), and with H=1.0 nm (b), 2.0 nm (c) and 3.0 nm (d) water filmsColor online