含水条件下单晶Cu的应力松弛及弹性恢复
史俊勤1,孙琨2,方亮2,许少锋3(
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Stress Relaxation and Elastic Recovery of Monocrystalline Cu Under Water Environment
Junqin SHI1,Kun SUN2,Liang FANG2,Shaofeng XU3()
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图3. 无水膜及水膜厚度为1.0、2.0、3.0 nm时单晶Cu的载荷-压深曲线
Fig.3. Load-indentation depth curves of without (a), and with H=1.0 nm (b), 2.0 nm (c) and 3.0 nm (d) water films (H—water film thickness)
