Al-Bi合金凝固过程及微合金化元素Sn的影响
黎旺1,2,孙倩1,2,江鸿翔1,赵九洲1,2()
Solidification of Al-Bi Alloy and Influence of Microalloying Element Sn
Wang LI1,2,Qian SUN1,2,Hongxiang JIANG1,Jiuzhou ZHAO1,2()

图9. Al-9.0%Bi和Al-9.0%Bi-0.10%Sn合金测量熔体温度(Tmelt)、平衡组元互溶温度(Tb)、过冷度(ΔTd=Tb-Tmelt)、富Bi相液滴形核率(Id)和α-Al体积分数(ξα-Al)随凝固时间的变化

Fig.9. Measured temperature (Tmelt), equilibrium bimodal line temperature (Tb), undercooling (ΔTd=Tb-Tmelt) of the matrix melt, nucleation rate of the Bi-rich droplets (Id) and the volume fraction of α-Al (ξα-Al) as a function of time during a cooling of the Al-9.0%Bi alloy (dash line) and Al-9.0%Bi-0.10%Sn alloy (solid line). The inserted figure is the enlargement of the microstructure evolution during the period from 3.47 s to 3.55 s. The subscripts 1 and 2 represent the primary droplets and the secondary droplets, respectively