N掺杂对磁控溅射Ta涂层微观结构与耐磨损性能的影响
杨莎莎,杨峰,陈明辉,牛云松,朱圣龙,王福会

Effect of Nitrogen Doping on Microstructure and Wear Resistance of Tantalum Coatings Deposited by Direct Current Magnetron Sputtering
Shasha YANG,Feng YANG,Minghui CHEN,Yunsong NIU,Shenglong ZHU,Fuhui WANG
表1 Ta涂层的制备工艺参数
Table 1 Deposition parameters of Ta and N-doped Ta coatings

Coating

Ar flow rate

mL·s-1

N2 flow rate

mL·s-1

Cathode power

kW

Deposition temperature

Base pressure

Pa

Sputtering

pressure

Pa

Deposition time

h

10Ar1002.02005.0×10-32.3×10-14
10Ar-1N21012.02005.0×10-32.3×10-14
10Ar-5N21052.02005.0×10-32.4×10-14
15Ar1502.02005.0×10-33.4×10-14
15Ar-5N21552.02005.0×10-33.5×10-14