合金元素对中温Sn-Ag-Cu焊料互连组织及剪切强度的影响
曹丽华1,陈胤伯1,2,史起源1,远杰1,2,刘志权1,2,3(
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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
CAO Lihua1,CHEN Yinbo1,2,SHI Qiyuan1,YUAN Jie1,2,LIU Zhiquan1,2,3()
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图5. S3样品器件侧IMC界面处的元素EDS线扫描分析
Fig.5. Interfacial image of S3 sample at the chip side (a) and the corresponding EDS line scans of Cu (b), Au (c), Sn (d), Ni (e) and Pd (f) across the line in Fig.5a
