合金元素对中温Sn-Ag-Cu焊料互连组织及剪切强度的影响
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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
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图4. S3样品的截面EPMA元素面扫描分布图 |
Fig.4. Cross sectional SEM image of S3 sample (a) and the corresponding elemental mapping of Sn (b), Ag (c), Cu (d), Ni (e), Au (f) and Pd (g) by EPMA analyses |
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