合金元素对中温Sn-Ag-Cu焊料互连组织及剪切强度的影响
曹丽华1,陈胤伯1,2,史起源1,远杰1,2,刘志权1,2,3(
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Effects of Alloy Elements on the Interfacial Microstructure and Shear Strength of Sn-Ag-Cu Solder
CAO Lihua1,CHEN Yinbo1,2,SHI Qiyuan1,YUAN Jie1,2,LIU Zhiquan1,2,3()
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图1. S1~S3样品器件侧和印刷电路板(PCB)侧的截面SEM像
Fig.1. Cross sectional SEM images of chip sides (a~c) and PCB sides (d~f) of S1 (a, d), S2 (b, e) and S3 (c, f) samples (PCB—printed circuit board, IMC—intermetallic compound)
