热压烧结温度对SiC/Al-Zn-Mg-Cu复合材料微观结构与力学性能的影响
马国楠1,2,王东1(
),刘振宇1,毕胜1,2,昝宇宁1,2,肖伯律1,马宗义1
),刘振宇1,毕胜1,2,昝宇宁1,2,肖伯律1,马宗义1
Effect of Hot Pressing Temperature on Microstructure and Tensile Properties of SiC/Al-Zn-Mg-Cu Composites
MA Guonan1,2,WANG Dong1(),LIU Zhenyu1,BI Sheng1,2,ZAN Yuning1,2,XIAO Bolv1,MA Zongyi1
),LIU Zhenyu1,BI Sheng1,2,ZAN Yuning1,2,XIAO Bolv1,MA Zongyi1
图7. 560 ℃下热压的T6态SiC/Al-7.5Zn-2.8Mg-1.7Cu复合材料界面产物的TEM像和元素分布图
Fig.7. TEM image and elemental distribution maps of interface of T6-treated SiC/Al-7.5Zn-2.8Mg-1.7Cu composites hot pressed at 560 ℃
