热压烧结温度对SiC/Al-Zn-Mg-Cu复合材料微观结构与力学性能的影响
马国楠1,2,王东1(),刘振宇1,毕胜1,2,昝宇宁1,2,肖伯律1,马宗义1
Effect of Hot Pressing Temperature on Microstructure and Tensile Properties of SiC/Al-Zn-Mg-Cu Composites
MA Guonan1,2,WANG Dong1(),LIU Zhenyu1,BI Sheng1,2,ZAN Yuning1,2,XIAO Bolv1,MA Zongyi1

图6. 不同热压温度制备T6态SiC/Al-7.5Zn-2.8Mg-1.7Cu复合材料的界面TEM像和HAADF-STEM像

Fig.6. TEM images of the interface of T6-treated SiC/Al-7.5Zn-2.8Mg-1.7Cu composites hot pressed at 500 ℃ (a), 520 ℃ (b), 540 ℃ (c), 560 ℃ (d, e), and HAADF-STEM image of Fig.6e (f) (Inset in Fig.6f shows the EDS analysis result of the interface reaction products)