热压烧结温度对SiC/Al-Zn-Mg-Cu复合材料微观结构与力学性能的影响
马国楠1,2,王东1(
),刘振宇1,毕胜1,2,昝宇宁1,2,肖伯律1,马宗义1
),刘振宇1,毕胜1,2,昝宇宁1,2,肖伯律1,马宗义1
Effect of Hot Pressing Temperature on Microstructure and Tensile Properties of SiC/Al-Zn-Mg-Cu Composites
MA Guonan1,2,WANG Dong1(),LIU Zhenyu1,BI Sheng1,2,ZAN Yuning1,2,XIAO Bolv1,MA Zongyi1
),LIU Zhenyu1,BI Sheng1,2,ZAN Yuning1,2,XIAO Bolv1,MA Zongyi1
图5. 不同热压温度制备T6态SiC/Al-7.5Zn-2.8Mg-1.7Cu复合材料的SE-SEM像和元素分布图
Fig.5. SE-SEM images (a, e, i) and elemental distribution maps of Zn (b, f, j), Mg (c, g, k) and Cu (d, h, l) in T6-treated SiC/Al-7.5Zn-2.8Mg-1.7Cu composites hot pressed at 520 ℃ (a~d), 540 ℃ (e~h) and 560 ℃ (i~l) (Arrows show the segregations)
