热压烧结温度对SiC/Al-Zn-Mg-Cu复合材料微观结构与力学性能的影响
马国楠1,2,王东1(
),刘振宇1,毕胜1,2,昝宇宁1,2,肖伯律1,马宗义1
),刘振宇1,毕胜1,2,昝宇宁1,2,肖伯律1,马宗义1
Effect of Hot Pressing Temperature on Microstructure and Tensile Properties of SiC/Al-Zn-Mg-Cu Composites
MA Guonan1,2,WANG Dong1(),LIU Zhenyu1,BI Sheng1,2,ZAN Yuning1,2,XIAO Bolv1,MA Zongyi1
),LIU Zhenyu1,BI Sheng1,2,ZAN Yuning1,2,XIAO Bolv1,MA Zongyi1
图4. 500 ℃热压烧结T6态SiC/Al-7.5Zn-2.8Mg-1.7Cu复合材料的SE-SEM像和元素分布图
Fig.4. SE-SEM image (a) and elemental distribution maps of Zn (b), O (c), Mg (d) and Cu (e) in T6-treated SiC/Al-7.5Zn-2.8Mg-1.7Cu composites hot pressed at 500 ℃ (m—atomic fraction)
