Sn-Ag-Cu钎料焊接显微组织演化和性能研究

金属学报. 2017, 53 (5): 615-621 doi: 10.11900/0412.1961.2016.00332

孙磊,陈明和,张亮,杨帆

Microstructures Evolution and Properties of Sn-Ag-Cu Solder Joints

Lei SUN,Minghe CHEN,Liang ZHANG,Fan YANG

图7 Sn3.0Ag0.5Cu焊点的SEM像、EDS面扫描图及XRD谱

Fig.7 SEM image (a), EDS elemental distribution map (b) and XRD spectrum (c) of Sn3.0Ag0.5Cu solder joint