金属学报. 2017, 53 (5): 615-621 doi: 10.11900/0412.1961.2016.00332



Sn-Ag-Cu钎料焊接显微组织演化和性能研究
孙磊,陈明和,张亮,杨帆

Microstructures Evolution and Properties of Sn-Ag-Cu Solder Joints
Lei SUN,Minghe CHEN,Liang ZHANG,Fan YANG
图3 热循环实验的温度循环载荷曲线
Fig.3 Loading specification of temperature cycle