Sn-Ag-Cu钎料焊接显微组织演化和性能研究
Microstructures Evolution and Properties of Sn-Ag-Cu Solder Joints
Sn-Ag-Cu钎料焊接显微组织演化和性能研究 |
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Microstructures Evolution and Properties of Sn-Ag-Cu Solder Joints |
| 图2 Sn-Ag-Cu焊点的力学性能测试示意图 |
| Fig.2 Schematics of pull force of quad flat package (QFP) (a) and shear test of chip resistor (b) of Sn-Ag-Cu solder joint |
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