Sn-Ag-Cu钎料焊接显微组织演化和性能研究
Microstructures Evolution and Properties of Sn-Ag-Cu Solder Joints
Sn-Ag-Cu钎料焊接显微组织演化和性能研究 |
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Microstructures Evolution and Properties of Sn-Ag-Cu Solder Joints |
| 图11 不同热循环时间下Sn-Ag-Cu 焊点的界面层厚度 |
| Fig.11 IMC layer thickness of Sn- Ag- Cu solder joints during different ageing times |
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