Sn-Ag-Cu钎料焊接显微组织演化和性能研究

金属学报. 2017, 53 (5): 615-621 doi: 10.11900/0412.1961.2016.00332

孙磊,陈明和,张亮,杨帆

Microstructures Evolution and Properties of Sn-Ag-Cu Solder Joints

Lei SUN,Minghe CHEN,Liang ZHANG,Fan YANG

图10 热循环500 cyc后Sn-Ag-Cu焊点界面层的SEM像

Fig.10 SEM images of interface layers of Sn0.3Ag0.7Cu (a), Sn1.0Ag0.5Cu (b) and Sn3.0Ag0.5Cu (c) solder joints after 500 cyc