金属学报. 2017, 53 (5): 615-621 doi: 10.11900/0412.1961.2016.00332



Sn-Ag-Cu钎料焊接显微组织演化和性能研究
孙磊,陈明和,张亮,杨帆

Microstructures Evolution and Properties of Sn-Ag-Cu Solder Joints
Lei SUN,Minghe CHEN,Liang ZHANG,Fan YANG
图1 无铅焊接回流曲线
Fig.1 Reflow soldering curve of lead-free solder