Cu/Sn-52In/Cu微焊点液-固电迁移行为研究

金属学报. 2017, 53 (5): 592-600 doi: 10.11900/0412.1961.2016.00499

张志杰,黄明亮

Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect

Zhijie ZHANG,Mingliang HUANG

图8 Cu/Sn-52In/Cu焊点液-固电迁移过程In原子扩散通量示意图

Fig.8 Schematics of the In atomic fluxes in Cu/Sn-52In/Cu interconnects during L-S EM (JchemInand JemIn are the In atomic fluxes induced by chemical potential gradient and EM, respectively)