Cu/Sn-52In/Cu微焊点液-固电迁移行为研究
Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect
Cu/Sn-52In/Cu微焊点液-固电迁移行为研究 |
|
Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect |
| 图7 Cu/Sn-52In/Cu焊点在120和180 ℃、2.0×104 A/cm2条件下电迁移过程中阴极Cu基体溶解动力学曲线 |
| Fig.7 Consumption kinetics of the cathode Cu in Cu/Sn-52In/Cu interconnects as a function of EM time under 2.0×104 A/cm2 at 120 and 180 ℃ |
|