Cu/Sn-52In/Cu微焊点液-固电迁移行为研究
Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect
Cu/Sn-52In/Cu微焊点液-固电迁移行为研究 |
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Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect |
| 图6 180 ℃、2.0×104 A/cm2液-固电迁移1 h后的Cu/Sn-52In/Cu焊点显微组织SEM像 |
| Fig.6 SEM images of the Cu/Sn-52In/Cu interconnects after L-S EM under 2.0×104 A/cm2 at 180 ℃ for 1 h(a) whole interconnect(b) anode interface(c) cathode interface |
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