Cu/Sn-52In/Cu微焊点液-固电迁移行为研究
Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect
Cu/Sn-52In/Cu微焊点液-固电迁移行为研究 |
|
Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect |
| 图3 Cu/Sn-52In/Cu焊点在120 ℃、2.0×104 A/cm2条件下液-固电迁移过程中的同步辐射照片 |
| Fig.3 Synchrotron radiation images of the Cu/Sn-52In/Cu interconnect during L-S EM under 2.0×104 A/cm2 at 120 ℃ for 0 min (a), 10 min (b), 20 min (c), 30 min (d), 40 min (e), 50 min (f), 60 min (g) and solidification (h) (L-S EM—liquid-solid electromigration, IMCs—intermetallic compouds) |
|