金属学报. 2017, 53 (5): 592-600 doi: 10.11900/0412.1961.2016.00499



Cu/Sn-52In/Cu微焊点液-固电迁移行为研究
张志杰,黄明亮

Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect
Zhijie ZHANG,Mingliang HUANG
图2 初始Cu/Sn-52In/Cu焊点显微组织SEM像
Fig.2 SEM images of as-soldered Cu/Sn-52In/Cu interconnect(a) macrograph(b) Cu/Sn-52In interface(c) Sn-52In/Cu interface