Cu/Sn-52In/Cu微焊点液-固电迁移行为研究
Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect
Cu/Sn-52In/Cu微焊点液-固电迁移行为研究 |
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Liquid-Solid Electromigration Behavior of Cu/Sn-52In/Cu Micro-Interconnect |
| 图1 Cu/Sn-52In/Cu线性焊点示意图 |
| Fig.1 Schematic of the line-type Cu/Sn-52In/Cu solder interconnect |
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