Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟
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马文婧,柯常波,周敏波,梁水保,张新平(
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PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM
Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG(
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图7. 模拟计算采用的二维区域示意图
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