Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟*
马文婧,柯常波,周敏波,梁水保,张新平(
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PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM
Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG()
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图4. 不同Cu3Sn层厚度下Cu/Cu3Sn界面Kirkendall空洞组织形貌
Fig.4. Simulated morphologies of Kirkendall voids at the Cu/Cu3Sn interface with thickness ratios of Cu3Sn layer to Cu layer being 1∶1 (a1~a3), 9∶10 (b1~b3) and 4∶5 (c1~c3) at t=0.6×105 (a1, b1, c1), 1×105 (a2, b2, c2) and 7×105 (a3, b3, c3) (Insets show the corresponding enlarged views)
