Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟*
马文婧,柯常波,周敏波,梁水保,张新平(
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PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM
Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG()
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图3. Cu/Cu3Sn界面和Cu3Sn层Kirkendall空洞在不同原子迁移率时的组织形貌
Fig.3. Simulated morphologies of Kirkendall voids at the Cu/Cu3Sn interface and in the Cu3Sn layer at mobilities of MCu=1 and MSn=0.05 (a), 0.01 (b) and 0.005 (c)
