Sn/Cu互连体系界面和金属间化合物层Kirkendall空洞演化和生长动力学的晶体相场法模拟*
马文婧,柯常波,周敏波,梁水保,张新平(
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PHASE-FIELD CRYSTAL SIMULATION ON EVOLU- TION AND GROWTH KINETICS OF KIRKENDALL VOIDS IN INTERFACE AND INTERMETALLIC COMPOUND LAYER IN Sn/Cu SOLDERING SYSTEM
Wenjing MA,Changbo KE,Minbo ZHOU,Shuibao LIANG,Xinping ZHANG()
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图2. Cu/Cu3Sn界面和Cu3Sn层Kirkendall空洞的模拟结果和组织形貌
Fig.2. Simulated morphologies of Kirkendall voids at the Cu/Cu3Sn interface and in the Cu3Sn layer at different time steps of t=0.1×105 (a), 3×105 (b), 5×105 (c), 7×105 (d) and the experimental observation of Kirkendall voids [3] in the Sn-3.0Ag-0.5Cu/Cu joint aged at 217 ℃ for 120 min (e) and 240 min (f)
