C对一种镍基高温合金与陶瓷型壳界面反应及润湿性的影响*
陈晓燕1,金喆2,白雪峰2,周亦胄1(
),金涛1,孙晓峰1
),金涛1,孙晓峰1
EFFECT OF C ON THE INTERFACIAL REACTION AND WETTABILITY BETWEEN A Ni-BASED SUPERALLOY AND CERAMIC MOULD
Xiaoyan CHEN1,Zhe JIN2,Xuefeng BAI2,Yizhou ZHOU1(),Tao JIN1,Xiaofeng SUN1
),Tao JIN1,Xiaofeng SUN1
图5. 非反应润湿(0.05%C)与反应润湿(0.2%C)合金/陶瓷界面组织形貌以及反应润湿体系合金/陶瓷界面处元素面分布
Fig.5. Interface microstructures of the non-reactive wetting system (0.05%C) (a), reactive wetting system (0.2%C) (b) and EMPA elemental distributions of the interfacial zone for the reactive wetting system (c1~c4)
