感应加热连续退火对铜包铝复合线材再结晶组织和界面金属间化合物的影响
姜雁斌, 刘新华, 王春阳, 莫永达, 谢建新

INFLUENCE OF INDUCTION HEATING CONTINUOUS ANNEALING ON RECRYSTALLIZATION AND INTER- FACIAL INTERMETALLIC COMPOUND OF COPPER-CLAD ALUMINUM WIRE
JIANG Yanbin, LIU Xinhua, WANG Chunyang, MO Yongda, XIE Jianxin
表2 感应加热连续退火和炉式等温退火复合线材Cu层和Al芯完全再结晶晶粒平均尺寸和界面金属间化合物厚度
Process condition Grain size / μm Thickness of intermetallic compound / μm
Copper Aluminum CuAl2 Cu9Al4 CuAl Total thickness
IHCA 430 ℃ 6.0 7.3 0.52 0.48 - 1.00
470 ℃ 7.2 12.0 0.64 0.58 - 1.22
TIA 350 ℃, 60 min 8.0 12.7 2.20 1.00 0.60 3.80
400 ℃, 60 min 10.0 17.0 2.50 1.40 1.10 5.00
450 ℃, 60 min - - 6.40 4.10 2.90 13.40