感应加热连续退火对铜包铝复合线材再结晶组织和界面金属间化合物的影响

姜雁斌, 刘新华, 王春阳, 莫永达, 谢建新

INFLUENCE OF INDUCTION HEATING CONTINUOUS ANNEALING ON RECRYSTALLIZATION AND INTER- FACIAL INTERMETALLIC COMPOUND OF COPPER-CLAD ALUMINUM WIRE

JIANG Yanbin, LIU Xinhua, WANG Chunyang, MO Yongda, XIE Jianxin

表2 感应加热连续退火和炉式等温退火复合线材Cu层和Al芯完全再结晶晶粒平均尺寸和界面金属间化合物厚度

Process condition		Grain size / μm		Thickness of intermetallic compound / μm
Process condition		Copper	Aluminum	CuAl₂	Cu₉Al₄	CuAl	Total thickness
IHCA	430 ℃	6.0	7.3	0.52	0.48	-	1.00
	470 ℃	7.2	12.0	0.64	0.58	-	1.22
TIA	350 ℃, 60 min	8.0	12.7	2.20	1.00	0.60	3.80
	400 ℃, 60 min	10.0	17.0	2.50	1.40	1.10	5.00
	450 ℃, 60 min	-	-	6.40	4.10	2.90	13.40