Sn/Cu互连体系界面金属间化合物Cu6Sn5演化和生长动力学的相场法模拟*

柯常波, 周敏波, 张新平

PHASE FIELD SIMULATION ON MICROSTRUCTURE EVOLUTION AND GROWTH KINETICS OF Cu6Sn5 INTERMETALLIC COMPOUND DURING EARLY INTERFACIAL REACTION IN Sn/Cu SOLDERING SYSTEM

KE Changbo, ZHOU Minbo, ZHANG Xinping

表3 不同 σ η L 时正常生长阶段IMC层厚度和晶粒横向粒径与时间的指数拟合结果

Table 3 Exponential fitting results of variations of IMC layer thickness and average width of Cu6Sn5 scalloptype grains with time during normal growth stage for different levels of η / L interfacial energy

σηL/ J/m2 IMC layer thickness Average width of Cu6Sn5 grain K T n T R2 KW nW R2 0.24 25.76 0.36 0.994 26.32 0.19 0.998 0.15 35.44 0.35 0.998 23.16 0.32 0.997 0.08 36.83 0.42 0.997 27.76 0.23 0.998