Sn/Cu互连体系界面金属间化合物Cu6Sn5演化和生长动力学的相场法模拟*

Processing math: 100%

Sn/Cu互连体系界面金属间化合物Cu₆Sn₅演化和生长动力学的相场法模拟^*

柯常波, 周敏波, 张新平

PHASE FIELD SIMULATION ON MICROSTRUCTURE EVOLUTION AND GROWTH KINETICS OF Cu₆Sn₅ INTERMETALLIC COMPOUND DURING EARLY INTERFACIAL REACTION IN Sn/Cu SOLDERING SYSTEM

KE Changbo, ZHOU Minbo, ZHANG Xinping

表2 不同D_GB下正常生长阶段IMC层厚度和晶粒横向粒径随时间变化的指数拟合结果

Table 2 Exponential fitting results of variations of IMC layer thickness and average width of Cu₆Sn₅ scallop-type grains with time during normal growth stage for different grain boundary diffusion coefficients

$D_{G B}$	IMC layer thickness			Scallop average width
$D_{G B}$	$K_{T}$	$n_{T}$	R²	K_W	n_W	R²
2.0×10³D_η	35.44	0.35	0.998	23.16	0.32	0.997
2.0×10²D_η	28.80	0.37	0.997	25.54	0.27	0.991
D_η	22.52	0.40	0.991	16.27	0.48	0.989