不同靶材料的高功率脉冲磁控溅射放电行为

吴忠振, 田修波, 潘锋, 付劲裕, 朱剑豪

HIGH POWER PULSED MAGNETRON SPUTTERING DISCHARGE BEHAVIOR OF VARIOUS TARGET MATERIALS

WU Zhongzhen, TIAN Xiubo, PAN Feng, FU K Y R, CHU K P

表1 6种靶材料的溅射产额[22]

Table 1 Sputtering yield of the six target materials[22]

Incident ion energy / eV Cu Cr Mo V Ti C 600 2.30 1.30 0.93 0.70 0.58 0.35 1000 2.80 1.50 1.30 1.05 0.74 0.61