PARTIALLY TRANSIENT LIQUID PHASE-DIFFUSION BONDING ON Ti(C, N)-Al2O3 CERAMIC MATRIX COMPOSITES USING Zr/Cu/Zr AS INTERLAYER

doi:10.3724/SP.J.1037.2013.00777

Acta Metall Sin

2014, Vol. 50

Issue (5): 619-625 DOI: 10.3724/SP.J.1037.2013.00777

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PARTIALLY TRANSIENT LIQUID PHASE-DIFFUSION BONDING ON Ti(C, N)-Al₂O₃ CERAMIC MATRIX COMPOSITES USING Zr/Cu/Zr AS INTERLAYER

WU Mingfang(

), KUANG Hongjin, WANG Fengjiang, LIN Hongxiang, XU Guoxiang

Key Laboratory of Advanced Welding Technology of Jiangsu Province, Jiangsu University of Science and Technology, Zhenjiang 212003

Cite this article:

WU Mingfang, KUANG Hongjin, WANG Fengjiang, LIN Hongxiang, XU Guoxiang. PARTIALLY TRANSIENT LIQUID PHASE-DIFFUSION BONDING ON Ti(C, N)-Al₂O₃ CERAMIC MATRIX COMPOSITES USING Zr/Cu/Zr AS INTERLAYER. Acta Metall Sin, 2014, 50(5): 619-625.

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Abstract

The partially transient liquid phase-diffusion bonding (PTLP-DB) on Ti(C, N)-Al₂O₃ ceramic matrix composites (CMC) was studied using the Zr foil/Cu foil/Zr foil sanwich as an interlayer. Effect of holding time during PTLP-DB on the element diffusion and reacted products at the interface was analyzed and the affected factors on the joint strength during PTLP-DB were explored. The effect of auxiliary pulse current during PTLP-DB between CMC on element diffusion at the interface and joint strength and its mechanism were also studied. The results showed that the optimum holding times were 15~30 min during PTLP-DB on CMC at 950 ℃. With a shorter holding time, the joint strength decreased due to the existance of unreacted Zr elements at the interface, while with a longer holding time, the joint strength decreased due to the overgrowth of CuZr intermetallics at the interface. With the auxiliary pulse current during PTLP-DB, the residual stress at the interface was greatly decreased, which inhibited the propagation of crack into the base materials. While, the auxiliary pulse current can promote the reaction between Cu and Zr and the formation of Zr-Cu intermetallics at the interface, which produced a weaked interface in the joints.

Key words: Ti(C N)-Al₂O₃ PTLP-DB element diffusion joint strength auxiliary pulse current

Received: 28 November 2013

ZTFLH:

TG454

Fund: Supported by National Natural Science Foundation of China (No.51175239), Jiangsu Provincial Research Foundation for Basic Research (No.BK2011494) and College Natural Science Foundation of Jiangsu Province (No.11KJA430005)

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	Mingfang WU
	Hongjin KUANG
	Fengjiang WANG
	Hongxiang LIN
	Guoxiang XU

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https://www.ams.org.cn/EN/10.3724/SP.J.1037.2013.00777 OR https://www.ams.org.cn/EN/Y2014/V50/I5/619

Fig.1

不同保温时间下的Ti(C, N)-Al₂O₃接头微观形貌及元素线分布图

表1 图1中特征点能谱测试结果

Fig.2

Ti(C, N)-Al₂O₃接头中反应产物的XRD谱

Fig.3

保温时间对Ti(C, N)-Al₂O₃接头强度的影响

Fig.4

不同保温时间下弯曲样品断口表面的SEM二次电子像

Fig.5

辅助脉冲电流对Ti(C, N)-Al₂O₃接头的界面形貌及元素扩散影响

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