PHASE FIELD SIMULATION ON MICROSTRUCTURE EVOLUTION AND GROWTH KINETICS OF Cu6Sn5 INTERMETALLIC COMPOUND DURING EARLY INTERFACIAL REACTION IN Sn/Cu SOLDERING SYSTEM

doi:10.3724/SP.J.1037.2013.00415

Acta Metall Sin

2014, Vol. 50

Issue (3): 294-304 DOI: 10.3724/SP.J.1037.2013.00415

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PHASE FIELD SIMULATION ON MICROSTRUCTURE EVOLUTION AND GROWTH KINETICS OF Cu₆Sn₅ INTERMETALLIC COMPOUND DURING EARLY INTERFACIAL REACTION IN Sn/Cu SOLDERING SYSTEM

KE Changbo^1,²(

), ZHOU Minbo², ZHANG Xinping²

1 School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640
2 School of Materials Science and Engineering, South China University of Technology, Guangzhou 510640

Cite this article:

KE Changbo, ZHOU Minbo, ZHANG Xinping. PHASE FIELD SIMULATION ON MICROSTRUCTURE EVOLUTION AND GROWTH KINETICS OF Cu₆Sn₅ INTERMETALLIC COMPOUND DURING EARLY INTERFACIAL REACTION IN Sn/Cu SOLDERING SYSTEM. Acta Metall Sin, 2014, 50(3): 294-304.

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Abstract

In the continuous pursuit of miniaturization, multifunction and high-reliability of electronic products and devices, the packing density has been increasing and the dimension of solder joints has been scaling down. In electronic packaging, during the soldering process being employed to Sn-based solders, an intermetallic compound (IMC) layer is formed between molten solder and pad (or under bump metallization, UBM), whose morphology and thickness as well as growth kinetics play an important role in controlling the service performance of the solder joints, in particular for solder interconnects with the decreasing size where the interfacial IMC layer takes up a high volume fraction in the solder joint. Thus, characterizing the morphology change and growth kinetics of interfacial IMC layer is very important to optimize the soldering process and evaluate the reliability of solder interconnects. In this study, a multi-phase-field model is applied to intensively account for the effect of grain boundary diffusion coefficient ( $D G B$ ) and IMC/liquid interfacial energy $σ η L$ on the morphology evolution and and growth kinetics of IMC. The simulation results show that Cu₆Sn₅ grains grow up and contact with each other exhibiting a scallop-like morphology which can be influenced by both the grain boundary diffusion coefficient and IMC/liquid interfacial energy. The IMC growth process exhibits three stages, including the initial stage associated with Cu₆Sn₅ grain broadening followed by the transition stage characterized by scallop shape formation and the last normal growth stage dominated by IMC layer thickening and concurrent Cu₆Sn₅ grain coarsening. It is also found that the IMC layer thickness increases with grain boundary diffusion coefficient but decreases with IMC/liquid interfacial energy, while the scallop average width decreases with grain boundary diffusion coefficient and increases with IMC/liquid interfacial energy. The relationships between IMC layer thickness/width and reaction time can be well fitted by an exponential growth law, in which the large grain boundary diffusion coefficient combined with $σ G B = 2 σ η L$ (where $σ G B$ is the grain boundary energy) can produce precise growth exponent closing to that in the ideal solid-liquid interface reaction.

Key words: intermetallic compound growth kinetics morphological evolution interfacial reaction phase field simulation

Received: 16 July 2013

ZTFLH:

TG113

Fund: Supported by National Natural Science Foundation of China (Nos.51275178 and 51205135) and Specialized Research Fund for the Doctoral Program of Higher Education of China(No.20110172110003) and Fundamental Research Funds for the Central Universities (No.2013ZM0026)

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柯常波, 男, 1981 年生, 博士

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	Changbo KE
	Minbo ZHOU
	Xinping ZHANG

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https://www.ams.org.cn/EN/10.3724/SP.J.1037.2013.00415 OR https://www.ams.org.cn/EN/Y2014/V50/I3/294

Fig.1

模拟计算采用的二维区域示意图

Table 1 Material parameters used in the simulation

Fig.2

IMC二维和三维形貌随时间的演化过程

Fig.3

IMC morphologies with different grain boundary diffusion coefficients (t=8 s)

(a) D_GB =2.0×103Dη (b) D_GB =2.0×102 Dη (c) D_GB = Dη

Fig.4 Curves of IMC layer thickness (a) and average width of Cu₆Sn₅scallop-type grains (b) vs time for different grain boundary diffusion coefficients

Fig.5 Exponential curves fitting for IMC layer thickness vs time during normal growth stage for different grain boundary diffusion coefficients

$D G B$	IMC layer thickness			Scallop average width
$D G B$	$K T$	$n T$	R²	K_W	n_W	R²
2.0×10³D_η	35.44	0.35	0.998	23.16	0.32	0.997
2.0×10²D_η	28.80	0.37	0.997	25.54	0.27	0.991
D_η	22.52	0.40	0.991	16.27	0.48	0.989

Table 2 Exponential fitting results of variations of IMC layer thickness and average width of Cu₆Sn₅ scallop-type grains with time during normal growth stage for different grain boundary diffusion coefficients

Fig.6 Microstructure of IMC layer with different levels of

η / L

interfacial energy

σ η L

(t=6 s) (a)

σ η L

=0.08 J/m2 (b)

σ η L

=0.15 J/m2 (c)

σ η L

=0.24 J/m2 (d) the energy balance relationship in triple junction point ( θ is the semi-dihedral angle)

Fig.7 Curves of IMC layer thickness (a) and average width of Cu₆Sn₅ scallop-type grains (b) vs time for different levels of interfacial energy (D_GB=2.0×10³D_η)

σ_ηL/ J/m²	IMC layer thickness			Average width of Cu₆Sn₅ grain
σ_ηL/ J/m²	$K T$	$n T$	R²	K_W	n_W	R²
0.24	25.76	0.36	0.994	26.32	0.19	0.998
0.15	35.44	0.35	0.998	23.16	0.32	0.997
0.08	36.83	0.42	0.997	27.76	0.23	0.998

Table 3 Exponential fitting results of variations of IMC layer thickness and average width of Cu₆Sn₅ scalloptype grains with time during normal growth stage for different levels of

η / L

interfacial energy

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