MoC掺杂钌基合金无籽晶阻挡层微结构及热稳定性研究
邹建雄1,刘波1(
),林黎蔚1,任丁1,焦国华2,鲁远甫2,徐可为3
),林黎蔚1,任丁1,焦国华2,鲁远甫2,徐可为3
Microstructure and Thermal Stability of MoC DopedRu-Based Alloy Films as Seedless Diffusion Barrier
Jianxiong ZOU1,Bo LIU1(),Liwei LIN1,Ding REN1,Guohua JIAO2,Yuanfu LU2,Kewei XU3
),Liwei LIN1,Ding REN1,Guohua JIAO2,Yuanfu LU2,Kewei XU3
图6. 试样A 500 ℃退火前后和试样B 400 ℃退火后的J-E曲线
Fig.6. J-E curves of as-deposited and 500 ℃ annealed sample A and 400 ℃ annealed sample B (J—current density, E—electric field intensity)
