MoC掺杂钌基合金无籽晶阻挡层微结构及热稳定性研究
邹建雄1,刘波1(
),林黎蔚1,任丁1,焦国华2,鲁远甫2,徐可为3
),林黎蔚1,任丁1,焦国华2,鲁远甫2,徐可为3
Microstructure and Thermal Stability of MoC DopedRu-Based Alloy Films as Seedless Diffusion Barrier
Jianxiong ZOU1,Bo LIU1(),Liwei LIN1,Ding REN1,Guohua JIAO2,Yuanfu LU2,Kewei XU3
),Liwei LIN1,Ding REN1,Guohua JIAO2,Yuanfu LU2,Kewei XU3
图3. 试样A和B的方块电阻随退火温度变化曲线
Fig.3. Sheet resistances of samples A and B as a function of annealing temperatures (Sample A—Cu/RuMoC II (5 nm)/p-SiOC∶H (200 nm)/Si, Sample B—Cu/Ru (5 nm)/p-SiOC∶H (200 nm)/Si)
