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倒装芯片无铅凸点β-Sn晶粒取向与电迁移交互作用 |
黄明亮(), 孙洪羽 |
大连理工大学材料科学与工程学院 先进连接技术辽宁省重点实验室 大连 116024 |
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Interaction Between β-Sn Grain Orientation and Electromigration Behavior in Flip-Chip Lead-Free Solder Bumps |
Mingliang HUANG(), Hongyu SUN |
Key Laboratory of Liaoning Advanced Welding and Joining Technology, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China |
引用本文:
黄明亮, 孙洪羽. 倒装芯片无铅凸点β-Sn晶粒取向与电迁移交互作用[J]. 金属学报, 2018, 54(7): 1077-1086.
Mingliang HUANG,
Hongyu SUN.
Interaction Between β-Sn Grain Orientation and Electromigration Behavior in Flip-Chip Lead-Free Solder Bumps[J]. Acta Metall Sin, 2018, 54(7): 1077-1086.
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