|
|
激光喷射钎料球键合焊点界面组织及其可靠性分析 |
王晓林1), 李明雨1), 王春青2) |
1) 哈尔滨工业大学深圳研究生院 材料学科部, 深圳 518055
2) 哈尔滨工业大学 现代焊接生产技术国家重点实验室, 哈尔滨 150001 |
|
MICROSTRUCTURE AND RELIABILITY OF LASER JET SOLDER BALL BONDING SOLDER JOINTS |
WANG Xiaolin1), LI Mingyu1), WANG Chunqing2) |
1) Department of Materials Science, Harbin Institute of Technology Shenzhen Graduate School, Shenzhen 518055
2) State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001 |
引用本文:
王晓林 李明雨 王春青. 激光喷射钎料球键合焊点界面组织及其可靠性分析[J]. 金属学报, 2010, 46(9): 1115-1120.
,
,
.
MICROSTRUCTURE AND RELIABILITY OF LASER JET SOLDER BALL BONDING SOLDER JOINTS[J]. Acta Metall Sin, 2010, 46(9): 1115-1120.
[1] Ho C E, Tsai S Y, and Kao C R. IEEE Trans Adv Packag, 2001; 24(4): 493-498
[2] Liu W, Wang C Q, Tian Y H, Li M Y. J Alloys Compd, 2008; 458(1-2): 323-329
[3] Tian Y H, Wang C Q, Ge X S. Mat Sci Eng B Solid, 2002; 95(3): 254-262
[4] Jiang C W, Yang S W, Chi Y. Machinery Manufacturing Engineer, 2005; 6: 46-48
(蒋传文, 杨圣文, 池勇. 现代制造工程, 2005; 6: 46-48)
[5] Liu X K, Yang S W, Jiang C W. Transactions of the China Welding Institution, 2006; 27(8): 83-87
(刘小康, 杨圣文, 蒋传文. 焊接学报, 2006; 27(8): 83-87)
[6] Yin L, Meschter S J, Singler T J. Acta Mater, 2004; 52(10): 2873-2888
[7] Liu Y Y. Master Thesis, Harbin Institute of Technology, 2007.
(刘永岳. 哈尔滨工业大学硕士学位论文, 2007)
[8] Zribi A, Chromik R R, Presthus R. IEEE Trans Compon Packag Technol, 2000; 23(2): 383-387
[9] Tang W M, He A Q, Liu Q, Ivey D G. Acta Mater, 2008; 56(19): 5818-5827
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
|
Shared |
|
|
|
|
|
Discussed |
|
|
|
|