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| 混装BGA器件高温老化实验焊点微观组织研究 |
| 杭春进,田艳红,赵鑫,王春青 |
| 哈尔滨工业大学先进焊接与连接国家重点实验室, 哈尔滨150001 |
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| RESEARCH ON MICROSTRUCTURE OF Pb-FREE BGA SOLDER JOINT ASSEMBLED WITH Sn-Pb SOLDER DURING ISOTHERMAL AGING |
| HANG Chunjin, TIAN Yanhong,ZHAO Xin, WANG Chunqing |
| State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001 |
引用本文:
杭春进,田艳红,赵鑫,王春青. 混装BGA器件高温老化实验焊点微观组织研究[J]. 金属学报, 2013, 49(7): 831-837.
HANG Chunjin,
TIAN Yanhong,
ZHAO Xin,
WANG Chunqing.
RESEARCH ON MICROSTRUCTURE OF Pb-FREE BGA SOLDER JOINT ASSEMBLED WITH Sn-Pb SOLDER DURING ISOTHERMAL AGING[J]. Acta Metall Sin, 2013, 49(7): 831-837.
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