金属学报  2011, Vol. 47 Issue (5): 601-604    DOI: 10.3724/SP.J.1037.2010.00668

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交流电作用下Au薄膜热疲劳失效行为的研究

王鸣, 张滨, 刘常升, 张广平

1) 东北大学材料与冶金学院材料各向异性与织构教育部重点实验室, 沈阳110819 2) 中国科学院金属研究所沈阳材料科学国家(联合)实验室, 沈阳110016

STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING

WANG Ming, ZHANG Bin, LIU Changsheng, ZHANG Guangping

1) Key Laboratory for Anisotropy and Texture of Materials (Ministry of Education), School of Materials and Metallurgy, Northeastern University, Shenyang 110819 2) Shenyang National Laboratory for Materials Science, Institute of Metal Research, Chinese Academy of Sciences, 72 Wenhua Road, Shenyang 110016

王鸣 张滨 刘常升 张广平. 交流电作用下Au薄膜热疲劳失效行为的研究[J]. 金属学报, 2011, 47(5): 601-604.
, , , . STUDY ON THERMAL FATIGUE FAILURE OF THIN GOLD FILM WITH ALTERNATING CURRENT LOADING[J]. Acta Metall Sin, 2011, 47(5): 601-604.

摘要 参考文献 相关文章 Metrics 全文: PDF(817 KB)   摘要: 本文研究了交流电致循环热应变作用下200 nm厚Au薄膜的失效行为. 结合实验结果和理论计算, 确定了交流电作用下6 μm宽Au薄膜导线上的温度分布, 并由此确定了Au互连线在交流电作用下达到稳定状态后的循环热应变范围. 结果表明, 应变范围Δε≦0.35%, 经过5×106 cyc热循环后, Au互连线中的晶粒出现不同程度的增长, 晶界损伤导致Au互连线的最终失效. 对Au薄膜热疲劳、机械疲劳失效行为及其机制进行了分析. 关键词 ： Au薄膜,  交流电,  热疲劳     Abstract：Metallization interconnects in microelectronic integrated circuits usually fail during fabrication and long-term service under electrical, mechanical, or thermal field and coupled multi-field of them, such as electromigration (EM) failure induced by direct current, stress-induced voiding (SIV) damage and thermal fatigue under thermal cyclic strain, which affect the reliability of the interconnects. Although EM and SIV have been actively investigated for several decades, there is limited work on thermal cyclic strain-induced thermal fatigue behaviors of thin metal films, which are becoming a more and more important reliability issue. In this work, the failure behavior of the 200 nm-thick Au thin films was studied through applying thermal cyclic strain generated by alternating current. The total thermal cyclic strain was determined from the temperature distribution along the Au line with a width of 6 μm according to the experiment measurement and theoretical calculation. It was found that the grain size in the Au thin films increased inhomogenously and the damage along grain boundaries resulted in the fatal failure of the Au line in the condition of Δε≦0.35% after 5$\times$10$^{6}$ cyc. Based on the experimental observations, thermal fatigue and mechanical fatigue failure behaviors were analyzed comparatively, and the basic mechanisms were discussed. Key words： gold film    alternating current    thermal fatigue 收稿日期: 2010-12-10      基金资助: 国家重点基础研究发展计划资助项目2010CB631003 作者简介: 王鸣, 男, 1982年生, 博士生 服务 把本文推荐给朋友 加入引用管理器 E-mail Alert RSS 作者相关文章 王鸣 张滨 刘常升 张广平 44.8K 链接本文: https://www.ams.org.cn/CN/10.3724/SP.J.1037.2010.00668      或      https://www.ams.org.cn/CN/Y2011/V47/I5/601 [1] Hau–Riege C S. Microelectron Reliab, 2004; 44: 195 [2] Zhang G P, Wang Z G. Acta Metall Sin, 2005; 41: l (张广平, 王中光. 金属学报, 2005; 41: 1) [3] Read D T. Int J Fatigue, 1998; 20: 203 [4] Schwaiger R, Kraft O. Scr Mater, 1999; 41: 823 [5] Schwaiger R, Kraft O. Acta Mater, 2003; 51: 195 [6] Zhang G P, Volkert C A, Schwaiger R, Wellner P, Arzt E, Kraft O. Acta Mater, 2006; 54: 3127 [7] Keller R R, M¨onig R, Volkert C A, Arzt E, Schwaiger R, Kraft O. AIP Proceedings of the 6th International Workshop of Stress Induced Phenomena in Metallization, New York: AIP, 2002: 119 [8] Monig R. PhD Thesis, University of Stuttgart, Germany, 2005 [9] Monig R, Keller R R, Volkert C A. Rev Sci Instrum, 2004; 75: 4997 [10] Park Y B, M¨onig R, Volkert C A. Thin Solid Films, 2007; 515: 3253 [11] Park Y B, M¨onig R, Volkert C A. Thin Solid Films, 2006; 504: 321 [12] Zhang G P, Volkert C A, Schwaiger R, M¨onig R, Kraft O. Microelectron Reliab, 2007; 47: 2007 [13] Wang M, Zhang B, Zhang G P, Liu C S. Scr Mater, 2009; 60: 803 [14] Guan Z D, Zhang Z T, Jiao J S. Inorganic Materials Physical Property. Beijing: Tsinghua University Press, 1992: 127 (关振铎, 张中太, 焦金生. 无机材料物理性能. 北京: 清华大学出版社, 1992: 127) [15] Zhang J, Zhang J Y, Liu G, Zhao Y, Ding X D, Zhang G P, Sun J. Scr Mater, 2009; 60: 228 [16] Zhang G P, Volkert C A, Schwaiger R, Arzt E, Kraft O. J Mater Res, 2005; 20: 201 [17] Zhang B, Sun K H, Liu Y D, Zhang G P. Acta Metall Sin, 2006; 42: 1 (张滨, 孙恺红, 刘永东, 张广平. 金属学报, 2006; 42: 1) [1] 王莉,何禹锋,申健,郑伟,楼琅洪,张健. 第二取向对第三代单晶高温合金热疲劳过程中冷却孔孔周氧化行为的影响研究[J]. 金属学报, 2019, 55(11): 1417-1426. [2] 张广平, 陈红蕾, 罗雪梅, 张滨. 微纳米尺度金属导电材料热疲劳研究进展[J]. 金属学报, 2018, 54(3): 357-366. [3] 万红霞,宋东东,刘智勇,杜翠薇,李晓刚. 交流电对X80钢在近中性环境中腐蚀行为的影响[J]. 金属学报, 2017, 53(5): 575-582. [4] 李宁,张蓉,张利民,邢辉,殷鹏飞,吴耀燕. 低压交流电脉冲下Al-7%Si合金晶粒细化机理研究[J]. 金属学报, 2017, 53(2): 192-200. [5] 王志胜, 陈祥, 李言祥, 张华伟, 刘源. B对铜合金压铸热作模具钢高温力学及热疲劳性能的影响*[J]. 金属学报, 2015, 51(5): 519-526. [6] 濮晟, 王莉, 谢光, 丁贤飞, 楼琅洪, 冯强. 缺口取向和再结晶对一种定向凝固钴基高温合金热疲劳性能的影响[J]. 金属学报, 2015, 51(4): 449-457. [7] 王莉,周忠娇,张少华,降向冬,楼琅洪,张健. 镍基单晶高温合金冷热循环过程中圆孔周围裂纹萌生与扩展行为[J]. 金属学报, 2015, 51(10): 1273-1278. [8] 程健, 谢飞, 孙力, 朱丽曼, 潘建伟. 交流电场增强45钢中低温粉末法渗硼特性[J]. 金属学报, 2014, 50(11): 1311-1318. [9] 刘光磊，司乃潮，孙少纯，张志坚，吴勤方. 多元Al-7.5Si-4Cu合金热疲劳裂纹萌生与扩展行为的研究[J]. 金属学报, 2013, 49(3): 303-310. [10] 肖旋 许辉 秦学智 郭永安 郭建亭 周兰章. 3种铸造镍基高温合金热疲劳行为研究[J]. 金属学报, 2011, 47(9): 1129-1134. [11] 姜子涛 杜艳霞 董亮 路民旭. 交流电对Q235钢腐蚀电位的影响规律研究[J]. 金属学报, 2011, 47(8): 997-1002. [12] 但体纯 吕战鹏 王俭秋 韩恩厚 庄子哲雄 柯伟. Ü690合金在高温水中的应力腐蚀裂纹扩展行为[J]. 金属学报, 2010, 46(10): 1267-1274. [13] 余建波; 任忠鸣; 任维丽; 邓康; 王俊 . 强磁场下电磁振荡对 Al--4.5%Cu合金凝固组织的影响[J]. 金属学报, 2008, 44(2): 172-176 . [14] 余建波; 任维丽; 邓康; 钟云波; 王洪亮 . 强磁场下电磁振荡对Al-Si过共晶合金凝固中初生硅分布和形貌的影响[J]. 金属学报, 2007, 43(9): 994-998 . [15] 余建波; 任忠鸣; 任维丽; 李喜; 王俊; 邓康 . 梯度磁场对纯Al在电磁振荡下凝固组织的影响[J]. 金属学报, 2007, 43(11): 1201-1206 . Viewed Full text Abstract Cited   Shared      Discussed